Our Approach
Our trimming process involves using laser technology to modify the resistor value by precisely removing material from the thick film. This method is suitable for various trim shapes including plunge, double plunge, L, and serpentine cuts, each tailored to specific resistor performance requirements.
- Advanced laser systems with a range of wavelengths for different trimming needs
- Customizable trimming options including various probe and test systems
- Ability to handle substrates of diverse sizes with high accuracy
- Detailed process control for achieving optimal resistor performance