Our Approach
Laser MicroMachining involves the use of laser technology to machine, cut, or modify materials at the micro-scale. It’s a key technique for creating intricate parts and features required in industries like semiconductors, medical, aerospace, and electronics.
- Micro Drilling and Cutting: We excel in creating precise micro-holes and intricate cuts in a variety of materials, ranging from metals to polymers.
- Surface Modification: Our laser technology allows for modifications at the surface level, altering the material’s properties to suit specific requirements.
- Precision Milling: We offer precision milling services to achieve micro-scale features with high accuracy.
- Cleanroom Packaging and Inspection: Ensuring the highest quality, our services include cleanroom packaging and thorough inspection of the micromachined components.
- Laser removal of semiconductor links to correct errant design or re-direct conductive paths.
- Solder mask removal
- Electroplating link/shorting bar removal
- Silicon, ceramic, plastic, SS / Al <0.005″ thick
- Al2O3 Ceramic <0.010″
- Polyimide / Kapton
- 1st harmonic (1064nm) and 3rd harmonic (355nm) pulsed YAG laser systems
- Spot size range = 3um – 50um (0.00015” – 0.002″),
- Hole diameters <0.001” possible, material composition/thickness dependent